UK-LMC
Laser Micromachining Ltd.
OpTIC Technium
St Asaph Business Park
Denbighshire
LL17 0JD
United Kingdom
Phone: +44 (0)1745 535165
Fax: +44 (0)1745 535101
n.rizvi@lasermicromachining.com
Silicon
Silicon, being the most mature material in the semiconductor industry, is widely used as a platform for many devices. As new products are developed, many sectors are demanding the machining of silicon-based chips or of devices held on silicon substrates.
The discrete machining of silicon wafers (scribing, cutting or drilling) or micro-structuring of on-wafer devices can be provided by LML with high quality.
30mm disc cut from 525 micron thick silicon wafer.
Edge quality from 525 micron thick silicon wafer.
Laser cutting of silicon wafers.
Laser diced silicon wafers with 50 micron thick sample in centre.
Micromilling of silicon.
Precision cutting of silicon wafers.
Silicon.
250um holes in 500um thick silicon wafer.